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Epoxy board

Specification :0.5-0 .8 mm
1-2mm
3-55mm
    Description:
This product is bonded with epoxy resin heated pressure produced in temperature mechanical properties, electrical properties and stability at high temperatures.
Product Use:
Applicable to mechanical, electrical and electronic high insulation parts with high mechanical and dielectric properties of good heat resistance and moisture resistance.
 

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Contact: Mr. zhang  Mobile: 18337422037   ADD: Bayi across the western part of the obligations Trade